AD9525SLASHPCBZ datasheet(12/48 Pages) AD

12 / 48 page

AD9525

Data Sheet

Rev. 0 | Page 12 of 48

ABSOLUTE MAXIMUM RATINGS

Table 20.

Parameter

Rating

VDD3 to GND

−0.3 V to +3.6 V

VDD_CP, CP to GND

−0.3 V to +5.8 V

REFA, REFA, REFB, REFB, REFC to GND

−0.3 V to VDD3 + 0.3 V

OUT_RSET to GND

−0.3 V to VDD3 + 0.3 V

CP_RSET to GND

−0.3 V to VDD3 + 0.3 V

CLKIN, CLKIN to GND

−0.3 V to VDD3 + 0.3 V

CLKIN to CLKIN

−1.2 V to +1.2 V

SCLK, SDIO, SDO, CS to GND

−0.3 V to VDD3 + 0.3 V

OUT0, OUT0, OUT1, OUT1, OUT2, OUT2,

OUT3, OUT3, OUT4, OUT4, OUT5, OUT5,

OUT6, OUT6, OUT7, OUT7,

SYNC_OUT, SYNC_OUT to GND

−0.3 V to VDD3 + 0.3 V

RESET, PD, STATUS, REF_MON to GND

−0.3 V to VDD3 + 0.3 V

Junction Temperature1

150°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (10 sec)

300°C

See Table 21 for θJA.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

Table 21. Thermal Resistance (Simulated)

Package

Type

Airflow

Velocity

(m/sec)

θJA1, 2

θJC1, 3

θJB1, 4

ΨJT1,2

Unit

48-Lead

LFCSP

27.3

2.1

14.7

0.2

°C/W

1.0

23.9

0.3

°C/W

2.5

21.4

0.4

°C/W

Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board.

Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

Per MIL-Std 883, Method 1012.1.

Per JEDEC JESD51-8 (still air).

ESD CAUTION

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