AD7858LARSZ datasheet(6/32 Pages) AD

6 / 32 page

REV. B

–6–

AD7858/AD7858L

ORDERING GUIDE

Linearity

Power

Error

Dissipation Package

Model

(LSB)

(mW)

Options

AD7858AN

±1

N-24

AD7858BN

±1/2

N-24

AD7858LAN

±1

6.85

N-24

AD7858LBN3

±1

6.85

N-24

AD7858AR

±1

R-24

AD7858BR

±1/2

R-24

AD7858LAR3

±1

6.85

R-24

AD7858LBR

±1

6.85

R-24

AD7858LARS

±1

6.85

RS-24

EVAL-AD7858CB4

EVAL-CONTROL BOARD

NOTES

1Linearity error here refers to integral linearity error.

2N = Plastic DIP; R = SOIC; RS = SSOP.

3L signifies the low-power version.

4This can be used as a stand-alone evaluation board or in conjunction with the EVAL-

CONTROL BOARD for evaluation/demonstration purposes.

5This board is a complete unit allowing a PC to control and communicate with all

Analog Devices evaluation boards ending in the CB designators.

ABSOLUTE MAXIMUM RATINGS

(TA = +25

°C unless otherwise noted)

AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

DVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

AVDD to DVDD . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V

Analog Input Voltage to AGND . . . . –0.3 V to AVDD + 0.3 V

Digital Input Voltage to DGND . . . . –0.3 V to DVDD + 0.3 V

Digital Output Voltage to DGND . . . –0.3 V to DVDD + 0.3 V

REFIN/REFOUT to AGND . . . . . . . . . –0.3 V to AVDD + 0.3 V

Input Current to Any Pin Except Supplies

. . . . . . .

±10 mA

Operating Temperature Range

Commercial (A, B Versions) . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW

θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105°C/W

θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . 34.7°C/W

Lead Temperature, (Soldering, 10 sec) . . . . . . . . . . +260

°C

SOIC, SSOP Package, Power Dissipation . . . . . . . . . . 450 mW

JA Thermal Impedance . . . 75

°C/W (SOIC) 115°C/W (SSOP)

θJC Thermal Impedance . . . . 25°C/W (SOIC) 35°C/W (SSOP)

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

NOTES

1Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

2Transient currents of up to 100 mA will not cause SCR latch-up.

PIN CONFIGURATIONS

DIP, SOIC, AND SSOP

TOP VIEW

(Not to Scale)

AD7858/

AD7858L

CONVST

DIN

CLKIN

SCLK

SYNC

BUSY

SLEEP

REFIN/REFOUT

DVDD

DGND

DOUT

AVDD

AGND

CREF1

CREF2

AIN1

AIN2

AIN7

AIN8

CAL

AIN3

AIN4

AIN6

AIN5

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the AD7858/AD7858L features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions

are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

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