AD8022

–4–

REV. 0

ORDERING GUIDE

Temperature

Package

Package

Model

Range

Description

Option

AD8022AR

–40

°C to +85°C

8-Lead Plastic SOIC

SO-8

AD8022ARM

–40

°C to +85°C

8-Lead microSOIC

RM-8

AD8022AR-EVAL

Evaluation Board

SO-8

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the AD8022 features proprietary ESD protection circuitry, permanent damage may occur on

devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are

recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

AMBIENT TEMPERATURE – C

2.0

–50

1.5

1.0

0.5

0

–40 –30 –20 –10 0

10

20 30

40 50

60 70

80 90

8-LEAD SOIC PACKAGE

8-LEAD MICROSOIC

Figure 2. Plot of Maximum Power Dissipation vs.

Temperature

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 V

Internal Power Dissipation

2

Small Outline Package (R) . . . . . . . . . . . . . . . . . . . . . 1.6 W

microSOIC Package (RM) . . . . . . . . . . . . . . . . . . . . . 1.2 W

Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . .

±V

S

Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . .

±0.8 V

Output Short Circuit Duration

. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves

Storage Temperature Range RM, R . . . . . . –65

°C to +125°C

Operating Temperature Range (A Grade) . . . –40

°C to +85°C

Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300

°C

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

8-Lead SOIC Package:

θ

8-Lead microSOIC Package:

θ

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the AD8022

is limited by the associated rise in junction temperature. The

maximum safe junction temperature for plastic encapsulated

devices is determined by the glass transition temperature of the

plastic, approximately 150

°C. Temporarily exceeding this limit

may cause a shift in parametric performance due to a change

in the stresses exerted on the die by the package. Exceeding a

junction temperature of 175

°C for an extended period can result

in device failure.

While the AD8022 is internally short circuit protected, this may not

be sufficient to guarantee that the maximum junction temperature

(150

°C) is not exceeded under all conditions. To ensure proper

operation, it is necessary to observe the maximum power derat-

ing curves.