MMA2201KEG

Sensors

Freescale Semiconductor

7

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self-align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

shorting between solder pads.

Figure 7. Footprint SOIC-16 (Case 475-01)

0.380 in.

9.65 mm

0.050 in.

1.27 mm

0.024 in.

0.610 mm

0.080 in.

2.03 mm