AD8565/AD8566/AD8567

–3–

REV. A

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Operating Temperature Range . . . . . . . . . . . –40

°C to +85°C

Junction Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Lead Temperature Range (Soldering, 60 sec) . . . . . . . . 300

°C

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the AD8565/AD8566/AD8567 features proprietary ESD protection circuitry, permanent damage

may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

ORDERING GUIDE

Temperature

Package

Branding

Range

Package Description

Option

Information

AD8565AKS

–40

°C to +85°C

5-Lead Plastic Surface-Mount

KS-5

ASA

AD8566ARM

–40

°C to +85°C

8-Lead MINI_SOIC

RM-8

ATA

AD8567ARU

–40

°C to +85°C

14-Lead Thin Shrink SO

RU-14

AD8567ACP

–40

°C to +85°C

16-Terminal Leadless Frame Chip Scale

CP-16

Package Type

JA

1

JC

Unit

5-Lead SC70 (KS)

376

126

°C/W

8-Lead MSOP (RM)

210

45

°C/W

14-Lead TSSOP (RU)

180

35

°C/W

16-Lead LFCSP (CP)

38

2

30

2

°C/W

NOTES

1

θ

θ

onto a circuit board for surface mount packages.