AD8605/AD8606/AD8608

Rev. D | Page 18 of 20

OUTLINE DIMENSIONS

PIN 1

1.60 BSC

2.80 BSC

1.90

BSC

0.95 BSC

1

3

4

5

2

0.22

0.08

10°

5°

0°

0.50

0.30

0.15 MAX

SEATING

PLANE

1.45 MAX

1.30

1.15

0.90

2.90 BSC

0.60

0.45

0.30

COMPLIANT TO JEDEC STANDARDS MO-178AA

Figure 57. 5-Lead Small Outline Transistor Package [SOT-23] (RT-5)

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN

COPLANARITY

0.10

14

8

7

1

6.20 (0.2441)

5.80 (0.2283)

4.00 (0.1575)

3.80 (0.1496)

8.75 (0.3445)

8.55 (0.3366)

1.27 (0.0500)

BSC

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0039)

0.51 (0.0201)

0.31 (0.0122)

1.75 (0.0689)

1.35 (0.0531)

8°

0°

0.50 (0.0197)

0.25 (0.0098)

1.27 (0.0500)

0.40 (0.0157)

0.25 (0.0098)

0.17 (0.0067)

COMPLIANT TO JEDEC STANDARDS MS-012AB

× 45°

Figure 58. 14-Lead Standard Small Outline Package [SOIC]

Narrow Body (R-14)

0.80

0.60

0.40

8°

0°

4

85

4.90

BSC

PIN 1

0.65 BSC

3.00

BSC

SEATING

PLANE

0.15

0.00

0.38

0.22

1.10 MAX

3.00

BSC

COPLANARITY

0.10

0.23

0.08

COMPLIANT TO JEDEC STANDARDS MO-187AA

Figure 59. 8-Lead Mini Small Outline Package [MSOP] (RM-8)

0.25 (0.0098)

0.17 (0.0067)

1.27 (0.0500)

0.40 (0.0157)

0.50 (0.0196)

0.25 (0.0099)

× 45°

8°

0°

1.75 (0.0688)

1.35 (0.0532)

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0040)

4

1

85

5.00 (0.1968)

4.80 (0.1890)

4.00 (0.1574)

3.80 (0.1497)

1.27 (0.0500)

BSC

6.20 (0.2440)

5.80 (0.2284)

0.51 (0.0201)

0.31 (0.0122)

COPLANARITY

0.10

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN

COMPLIANT TO JEDEC STANDARDS MS-012AA

Figure 60. 8-Lead Standard Small Outline Package [SOIC] Narrow Body (R-8)

4.50

4.40

4.30

14

8

7

1

6.40

BSC

PIN 1

5.10

5.00

4.90

0.65

BSC

SEATING

PLANE

0.15

0.05

0.30

0.19

1.20

MAX

1.05

1.00

0.80

0.20

0.09

8°

0°

0.75

0.60

0.45

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153AB-1

Figure 61. 14-Lead Thin Shrink Small Outline Package [TSSOP] (RU-14)

SEATING

PLANE

0.50 REF

0.87

0.37

0.36

0.35

0.17

0.14

0.12

0.21

0.50

0.20

0.50

0.23

0.18

0.14

BOTTOM VIEW

0.94

0.90

0.86

1.33

1.29

1.25

TOP VIEW

(BALL SIDE DOWN)

PIN 1

IDENTIFIER

Figure 62. 5-Bump 2 × 1 × 2 Array MicroCSP [WLCSP] (CB-5)