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ADF4106BCP 데이터시트(PDF) 4 Page - Analog Devices |
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ADF4106BCP 데이터시트(HTML) 4 Page - Analog Devices |
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4 / 20 page ![]() REV. 0 ADF4106 –4– ABSOLUTE MAXIMUM RATINGS 1, 2 (TA = 25 °C unless otherwise noted.) AVDD to GND 3 . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +3.6 V AVDD to DVDD . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V VP to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.3 V VP to AVDD . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.5 V Digital I/O Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V Analog I/O Voltage to GND . . . . . . . . . –0.3 V to VP + 0.3 V REFIN, RFINA, RFINB to GND . . . . . . –0.3 V to VDD + 0.3 V Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Maximum Junction Temperature . . . . . . . . . . . . . . . . 150 °C TSSOP JA Thermal Impedance . . . . . . . . . . . . . 150.4 °C/W CSP JA Thermal Impedance . . . . . . . . . . . . . . . . . . 122 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2This device is a high-performance RF integrated circuit with an ESD rating of <2 kV and it is ESD sensitive. Proper precautions should be taken for handling and assembly. 3GND = AGND = DGND = 0 V ORDERING GUIDE Model Temperature Range Package Option * ADF4106BRU –40 °C to +85°C RU-16 ADF4106BCP –40 °C to +85°C CP-20 *RU = Thin Shrink Small Outline Package (TSSOP) CP = Chip Scale Package Contact the factory for chip availability. Note that aluminum bond wire should not be used with the ADF4106 die. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADF4106 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE |
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