®

© Coilcraft, Inc. 2012

1102 Silver Lake Road

Cary, IL 60013

Phone 800-981-0363

Fax 847-639-1508

Email cps@coilcraft.com

www.coilcraft-cps.com

This product may not be used in medical or high

risk applications without prior Coilcraft approval.

Specifications subject to change without notice.

Please check our web site for latest information.

1008 CHIP INDUCTORS

The MS413RAA features high temperature materials that

allow operation in ambient temperatures up to 155°C

and a leach-resistant base metalization with tin-lead (Sn-

Pb) terminations that ensures the best possible board

adhesion.

10

100

Frequency (MHz)

1000

10000

100

100

120

90

70

80

60

50

40

30

20

10

0

47 nH

12 nH

330 nH

750 nH

1800 nH

100 nH

Typical Q vs Frequency

Typical L vs Frequency

A max B max C max D ref

E

F

G

H

I

J

0.115

0.110

0.080 0.020 0.080 0.020

0.060 0.100 0.040 0.050

2,92

2,79

2,03

0,51

2,03

0,51

1,52

2,54

1,02

1,27

• HighSRFandexcellentQvalues

• Tighttolerances,manyvaluesat1%

• 28inductancevaluesfrom10nHto1µH

Core material Ceramic

Terminations Tin-lead(63/37)oversilver-platinum-glassfrit

Ambient temperature –55°C to +125°C with Imaxcurrent,+125°C

to +155°C with derated current

Storage temperature Component: –55°C to +155°C.

Tape and reel packaging: –55°C to +80°C

Resistance to soldering heat Maxthree40secondreflowsat

+260°C,partscooledtoroomtemperaturebetweencycles

Temperature Coefficient of Inductance (TCL) +25 to +155 ppm/°C

Moisture Sensitivity Level (MSL) 1(unlimitedfloorlifeat<30°C/

85%relativehumidity)

Enhanced crush-resistant packaging 2000 per 7

″ reel

Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing,

2.0 mm pocket depth

-40 -20

020406080

100

160

140

120

Ambient temperature (°C)

120

110

100

90

80

70

60

50

40

30

20

10

0

Current Derating

J

H

A

B

overall

F

G

E

terminal

F

C

D

Terminal wraparound:

approx 0.015/0,38 both ends

I

I

Suggested

Land Pattern

Note: Dimensionsarebeforesolderapplication.Formaximumoverall

dimensions including solder, add 0.0025 in / 0,064 mm to

B and

0.006 in / 0,15 mm to

A and C.

DocumentMS101-1 Revised11/28/12