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MS541PYA 데이터시트(PDF) 1 Page - Coilcraft lnc.

부품명 MS541PYA
상세설명  High-Reliability Power Inductors
PDF  4 Pages
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제조업체  COILCRAFT [Coilcraft lnc.]
홈페이지  http://www.coilcraft.com
Logo COILCRAFT - Coilcraft lnc.

MS541PYA 데이터시트(HTML) 1 Page - Coilcraft lnc.

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®
© Coilcraft, Inc. 2013
1102 Silver Lake Road
Cary, IL 60013
Phone 800-981-0363
Fax 847-639-1508
Email cps@coilcraft.com
www.coilcraft-cps.com
This product may not be used in medical or high
risk applications without prior Coilcraft approval.
Specifications subject to change without notice.
Please check our web site for latest information.
1. When ordering, please specify
testing code:
MS541PYA682MSZ
Testing: Z = COTS
H = Screening per Coilcraft CP-SA-10001
N = Screening per Coilcraft CP-SA-10004
2. Inductance tested at 100 kHz, 0.1 Vrms using an Agilent/HP 4192A.
3. DCR measured on a micro-ohmmeter.
4. SRF measured using an Agilent/HP 4395A or equivalent.
5. Typical dc current at which the inductance drops 30% from its value without current.
6. Typical current that causes the specified temperature rise from 25°C ambient.
7. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
Inductance2
DCR (mOhms)3
SRF (MHz)4
Isat5
Irms (A)6
Part number1
±20% (µH)
typ
max
min
typ
(A)
20°C rise 40°C rise
MS541PYA161MSZ
0.16
0.75
0.83
166
207
78.0
22.9
27.1
MS541PYA301MSZ
0.30
1.06
1.17
108
135
55.6
19.6
25.1
MS541PYA551MSZ
0.55
1.42
1.56
71
89
43.0
17.6
21.8
MS541PYA651MSZ
0.65
1.75
1.93
59
74
40.0
15.8
19.9
MS541PYA801MSZ
0.80
2.08
2.29
54
67
37.8
15.6
19.4
MS541PYA102MSZ
1.0
2.55
2.81
51
64
34.8
15.0
18.8
MS541PYA122MSZ
1.2
3.10
3.41
34
43
31.2
12.2
16.2
MS541PYA182MSZ
1.8
4.05
4.46
34
43
25.0
11.9
15.8
MS541PYA222MSZ
2.2
5.73
6.33
28
35
19.6
9.9
13.4
MS541PYA332MSZ
3.3
8.56
9.42
26
32
19.4
8.7
11.3
MS541PYA472MSZ
4.7
12.96
14.26
21
26
15.2
7.9
10.2
MS541PYA562MSZ
5.6
13.67
15.03
17
21
13.0
6.4
8.6
MS541PYA682MSZ
6.8
17.84
19.62
16
20
12.8
5.1
6.9
7070 POWER INDUCTORS
High-Reliability PowerInductorsMS541PYA
Core material Composite
Terminations Tin-lead (63/37) over copper.
Weight 1.9 – 2.1g
Ambient temperature –55°C to +105°C with Irms current, +105°C to
+155°C with derated current
Storage temperature Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C
Resistance to soldering heat Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging 150 per 7
″reel
Plastic tape: 16 mm wide, 0.3 mm thick, 12 mm pocket spacing,
7.21 mm pocket depth
High temperature materials allow operation in ambient
temperatures up to 155°C
Passes vibration testing to 80 G and shock testing to 1000 G
Tin-lead (Sn-Pb) termination for the best possible board
adhesion
High current and very low DCR
Soft saturation makes them ideal for VRM/VRD applications.
Irms Testing
Irms testing was performed on a
0.060
″ thick pcb with 4 oz. copper
traces optimized to minimize
additional temperature rise.
Temperature rise is highly
dependent on many factors
including pcb land pattern,
trace size, and proximity to
other components. Therefore
temperature rise should be
verified in application conditions.
Document MS856-1 Revised 01/08/13


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