24-Lead Cerdip (Q-24)

PIN 1

1

24

12

13

1

0.295 (7.493)

MAX

SEATING

PLANE

0.225

(5.715)

MAX

0.125

(3.175)

MIN

0.070 (1.778)

0.020 (0.508)

0.180

(4.572)

MAX

1.290 (32.77) MAX

0.021 (0.533)

0.015 (0.381)

TYP

0.065 (1.651)

0.055 (1.397)

TYP

0.110 (2.794)

0.090 (2.286)

TYP

0.320 (8.128)

0.290 (7.366)

15

°

0

°

0.012 (0.305)

0.008 (0.203)

TYP

1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH.

2. CERDIP LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED

IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.

24-Lead SOIC (R-24)

0.013 (0.32)

0.009 (0.23)

0.042 (1.067)

0.018 (0.447)

6

°

0

°

0.03 (0.76)

0.02 (0.51)

PIN 1

0.299 (7.6)

0.291 (7.39)

0.414 (10.52)

0.398 (10.10)

13

12

1

24

1. LEAD NO. 1 IDENTIFIED BY A DOT.

2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED

IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS

0.019 (0.49)

0.014 (0.35)

0.05 (1.27)

BSC

0.096 (2.44)

0.089 (2.26)

0.608 (15.45)

0.596 (15.13)

0.01 (0.254)

0.006 (0.15)

28-Lead SOIC (R-28)

0.019 (0.49)

0.014 (0.35)

0.05 (1.27)

BSC

0.708 (18.02)

0.696 (17.67)

0.01 (0.254)

0.006 (0.15)

0.096 (2.44)

0.089 (2.26)

0.013 (0.32)

0.009 (0.23)

0.042 (1.067)

0.018 (0.457)

6

°

0

°

0.03 (0.76)

0.02 (0.51)

PIN 1

0.299 (7.6)

0.291 (7.39)

0.414 (10.52)

0.398 (10.10)

15

14

1

28

1. LEAD NO. IDENTIFIED BY A DOT.

2. SOICLEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED

IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.

28-Lead SSOP (RS-28)

1. LEAD NO. 1 IDENTIFIED BY A DOT.

2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED

IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS

0.009 (0.229)

0.005 (0.127)

0.037 (0.94)

0.022 (0.559)

8

°

0

°

0.0256 (0.65)

BSC

0.407 (10.34)

0.397 (10.08)

0.008 (0.203)

0.002 (0.050)

0.07 (1.78)

0.066 (1.67)

PIN 1

15

14

1

28

0.311 (7.9)

0.301 (7.64)

0.212 (5.38)

0.205 (5.207)

–16–