STPRF1650CT datasheet(1/2 Pages) SIRECT

부품명	STPRF1650CT

상세설명	Ultra Fast Recovery Diodes

PDF	2 Pages

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제조업체	SIRECT [Sirectifier Global Corp.]

홈페이지	http://www.sirectsemi.com

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1 / 2 page

STPRF1650CT thru STPRF1660CT

FEATURES

* Glass passivated chip

* Superfast switching time for high efficiency

* Low forward voltage drop and high current capability

* Low reverse leakage current

* High surge capacity

MECHANICAL DATA

* Case: TO-220AB molded plastic

* Polarity: As marked on the body

* Weight: 0.08 ounces, 2.24 grams

* Mounting position: Any

A=Anode, C=Cathode, TAB=Cathode

Symbol

Characteristics

I(AV)

Maximum Average Forward Rectified Current

@TC=100 C

IFSM

Peak Forward Surge Current 8.3ms Single Half-Sine-Wave

Superimposed On Rated Load (JEDEC METHOD)

Maximum Forward Voltage At 8.0A DC

VF

IR

Maximum DC Reverse Current

At Rated DC Blocking Voltage

@TJ=25 C

@TJ=100 C

CJ

Typical Thermal Resistance (Note 3)

TRR

Maximum Reverse Recovery Time (Note 2)

Typical Junction Capacitance Per Element (Note 1)

TJ, TSTG

Operating And Storage Temperature Range

Maximum Ratings

16

125

1.5

5

500

80

50

1.5

-55 to +150

A

V

Unit

uA

pF

ns

o

ROJC

C/W

o

C

o

NOTES: 1. Measured At 1.0MHz And Applied Reverse Voltage Of 4.0V DC.

2. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A.

3. Thermal Resistance Junction To Case.

A

C

C(TAB)

A

C

A

Dim.

A

B

C

D

E

F

G

H

J

K

M

N

Q

R

Milimeter

Min.

Max.

12.70

13.97

14.73

16.00

9.91

10.66

3.54

4.08

5.85

6.85

2.54

3.18

1.15

1.65

2.79

5.84

0.64

1.01

2.54

BSC

4.32

4.82

1.14

1.39

0.35

0.56

2.29

2.79

Inches

Min.

Max.

0.500

0.550

0.580

0.630

0.390

0.420

0.139

0.161

0.230

0.270

0.100

0.125

0.045

0.065

0.110

0.230

0.025

0.040

0.100

BSC

0.170

0.190

0.045

0.055

0.014

0.022

0.090

0.110

Dimensions TO-220AB

STPRF1650CT

STPRF1660CT

VRRM

V

500

600

VRMS

V

350

420

VDC

V

500

600

Ultra Fast Recovery Diodes

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STPRF1650CT 데이터시트(PDF) 1 Page - Sirectifier Global Corp.

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