ISO7631FM, ISO7631FC

ISO7640FC, ISO7641FC

SLLSEC3A – SEPTEMBER 2012 – REVISED SEPTEMBER 2012

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ABSOLUTE MAXIMUM RATINGS

(1)

VALUE

PARAMETER

UNIT

MIN

MAX

–0.5

6

V

Voltage

INx, OUTx, ENx

–0.5

6

V

±15

mA

Human Body Model

ESDA, JEDEC JS-001-2012

±4

kV

Field-Induced Charged Device

Electrostatic discharge

JEDEC JESD22-C101E

All pins

±1.5

kV

Model

Machine Model

JEDEC JESD22-A115-A

±200

V

150

°C

-65

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values except differential I/O bus voltages are with respect to the local ground terminal (GND1 or GND2) and are peak

voltage values.

RECOMMENDED OPERATING CONDITIONS

PARAMETER

MIN

TYP

MAX

UNIT

M-Grade

2.7

5.5

Supply voltage

V

C-Grade

3

5.5

High-level output current

-4

mA

Low-level output current

4

mA

High-level input voltage

2

V

Low-level input voltage

0

0.8

V

M-Grade:

≥3V-Operation

6.67

Input pulse duration

M-Grade: <3V-Operation

10

ns

C-Grade:

≥3V-Operation

40

M-Grade:

≥3V-Operation

0

150

Signaling rate

M-Grade: <3V-Operation

0

100

Mbps

C-Grade:

≥3V-Operation

0

25

Junction temperature

-40

136

°C

Ambient temperature

-40

25

125

°C

THERMAL INFORMATION

ISO76xx

UNITS

DW (16 Pins)

Junction-to-ambient thermal resistance

72

Junction-to-case(top) thermal resistance

38

Junction-to-board thermal resistance

39

°C/W

Junction-to-top characterization parameter

9.4

Junction-to-board characterization parameter

n/a

Junction-to-case(bottom) thermal resistance

n/a

Maximum Device Power Dissipation

399

mW

Input a 75 MHz 50% duty cycle square wave

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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