DAC8222FS datasheet(3/15 Pages) AD

3 / 15 page

DAC8222

–3–

REV. C

ABSOLUTE MAXIMUM RATINGS

(TA = +25

°C, unless otherwise noted.)

VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V, +17 V

VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V, +17 V

AGND to DGND . . . . . . . . . . . . . . . . . . –0.3 V, VDD +0.3 V

Digital Input Voltage to DGND . . . . . . . –0.3 V, VDD +0.3 V

IOUTA, IOUTB to AGND . . . . . . . . . . . . . . –0.3 V, VDD +0.3 V

VREFA, VREFB to AGND . . . . . . . . . . . . . . . . . . . . . . . . .

±25 V

VRFBA, VRFBB to AGND . . . . . . . . . . . . . . . . . . . . . . . . .

±25 V

Operating Temperature Range

AW Version . . . . . . . . . . . . . . . . . . . . . . . –55

°C to +125°C

EW, FW, FP Versions . . . . . . . . . . . . . . . . –40

°C to +85°C

GP, HP, HS Versions . . . . . . . . . . . . . . . . . . . 0

°C to +70°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

Storage Temperature . . . . . . . . . . . . . . . . . . –65

°C to +150°C

Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300

°C

Package Type

Units

24-Lead Hermetic DIP (W)

°C/W

24-Lead Plastic DIP (P)

°C/W

24-Lead SOL (S)

°C/W

NOTE

JA is specified for worst-case mounting conditions, i.e., qJA is specified for

device in socket for Cerdip, and P-DIP packages; JA is specified for device

soldered to printed circuit board for SO package.

CAUTION

1. Do not apply voltages higher than VDD or less than GND

potential on any terminal except VREF and RFB.

2. The digital control inputs are Zener-protected; however,

permanent damage may occur on unprotected units from

high-energy electrostatic fields. Keep units in conductive

foam at all times until ready to use.

3. Do not insert this device into powered sockets; remove

power before insertion or removal.

4. Use proper antistatic handling procedures.

5. Devices can suffer permanent damage and/or reliability deg-

radation if stressed above the limits listed under Absolute

Maximum Ratings for extended periods.

PIN CONNECTIONS

24-Lead 0.3" Cerdip

24-Lead Plastic DIP

24-Lead SOL

28-Terminal LCC

NC = NO CONNECT

ORDERING GUIDE

INL

GFSE

Temperature

Package

Model

(LSB) (LSB)

Range

Description

Option

DAC8222EW

±1/2

± 1

–40

°C to +85°C

Cerdip-24

Q-24

DAC8222GP

±1/2

± 20°C to +70°C

P-DIP-24

N-24

DAC8222BTC/883*

±1

± 4

–55

°C to +125°C LCC-28

E-28A

DAC8222FW

±1

± 4

–40

°C to +85°C

Cerdip-24

Q-24

DAC8222FP

±1

± 4

–40

°C to +85°C

P-DIP-24

N-24

DAC8222FS

±1

± 4

–40

°C to +85°C

SOL-24

R-24

*Consult factory for DAC8222/883 MIL-STD data sheet.

WARNING!

ESD SENSITIVE DEVICE

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the DAC8222 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

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