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OP90AZ/883 데이터시트(PDF) 5 Page - Analog Devices

부품명 OP90AZ/883
상세설명  Precision Low-Voltage Micropower Operational Amplifier
PDF  12 Pages
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OP90AZ/883 데이터시트(HTML) 5 Page - Analog Devices

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REV. A
OP90
–5–
ORDERING GUIDE
Package Options
TA = 25 C
Operating
VOS Max
CERDIP
Plastic
Temperature
(mV)
8-Lead
8-Lead
Range
150
OP90AZ/883
*
MIL
150
OP90EZ
*
IND
450
OP90GP
XIND
450
OP90GS
XIND
*Not for new design, obsolete April 2002.
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±18 V
Differential Input Voltage . . . . [(V–) – 20 V] to [(V+) + 20 V]
Common-Mode Input Voltage . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . [(V–) – 20 V] to [(V+) + 20 V]
Output Short-Circuit Duration . . . . . . . . . . . . . . . . Indefinite
Storage Temperature Range
Z Package . . . . . . . . . . . . . . . . . . . . . . . . . –65
°C to +150°C
P Package . . . . . . . . . . . . . . . . . . . . . . . . . –65
°C to +150°C
Operating Temperature Range
OP90A . . . . . . . . . . . . . . . . . . . . . . . . . . . –55
°C to +125°C
OP90E . . . . . . . . . . . . . . . . . . . . . . . . . . . . –25
°C to +85°C
OP90G . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
Junction Temperature (TJ) . . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature (Soldering 60 sec) . . . . . . . . . . . . . . 300
°C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the OP90 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
Package Type
JA
2
JC
Unit
8-Lead Hermetic DIP (Z)
148
16
°C/W
8-Lead Plastic DIP (P)
103
43
°C/W
8-Lead SO (S)
158
43
°C/W
NOTES
1Absolute Maximum Ratings apply to packaged parts, unless otherwise noted.
2
JA is specified for worst-case mounting conditions; i.e.,
JA is specified for
device in socket for CerDIP, and P-DIP; JA is specified for devices soldered to
printed circuit board for SO package.



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