LTC3621/LTC3621-2

15

3621f

For more information www.linear.com/LTC3621

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

package DescripTion

MSOP (MS8E) 0911 REV J

0.53

± 0.152

(.021

± .006)

SEATING

PLANE

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD

SHALL NOT EXCEED 0.254mm (.010") PER SIDE.

0.18

(.007)

0.254

(.010)

1.10

(.043)

MAX

0.22 – 0.38

(.009 – .015)

TYP

0.86

(.034)

REF

0.65

(.0256)

BSC

0

° – 6° TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

1 2 3 4

4.90

± 0.152

(.193

± .006)

8

8

1

BOTTOM VIEW OF

EXPOSED PAD OPTION

7 6 5

3.00

± 0.102

(.118

± .004)

(NOTE 3)

3.00

± 0.102

(.118

± .004)

(NOTE 4)

0.52

(.0205)

REF

1.68

(.066)

1.88

(.074)

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

1.68

± 0.102

(.066

± .004)

1.88

± 0.102

(.074

± .004)

0.889

± 0.127

(.035

± .005)

RECOMMENDED SOLDER PAD LAYOUT

0.65

(.0256)

BSC

0.42

± 0.038

(.0165

± .0015)

TYP

0.1016

± 0.0508

(.004

± .002)

DETAIL “B”

DETAIL “B”

CORNER TAIL IS PART OF

THE LEADFRAME FEATURE.

FOR REFERENCE ONLY

NO MEASUREMENT PURPOSE

0.05 REF

0.29

REF

MS8E Package

8-Lead Plastic MSOP, Exposed Die Pad

(Reference LTC DWG # 05-08-1662 Rev J)