ML2002_11 datasheet(12/13 Pages) MINILOGIC

부품명	ML2002

상세설명	Static/Half Duty LCD COG Driver A Gold Bump Chip which can reduce pin count and area

PDF	13 Pages

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제조업체	MINILOGIC [Minilogic Device Corporation Limited]

홈페이지	http://www.minilogic.com.hk

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12 / 13 page

P12/13

Version 0.6 Preliminary, Sept 2011

ML2002 Preliminary

1. To ensure the good flip-chip assembly quality, we suggest flip-chip bonding house add a “CHECK”

pin for each COG module as shown on the section of “Application Example”. Pin “LOAD” and Pin

“CHECK” shall be connected together if the flip-chip assembly is in good condition. The measured

resistance between Pin “LOAD” and Pin “CHECK” shall not more than 5 kohm.

2. The resistance of ITO glass shall between 15 ohm/□ to 25 ohm/□.

3. Each Common (ie. COM1A and COM1B) shall not cover more than 2,000 mm

2 area. In case the

Viewing area of LCD has to be more than 2,000 mm

2, IOEN pin has to be connected to outside. At the

time where data is transferring into the IC, internal oscillator has to be disabled through IOEN pin to

prevent abnormal behavior. When data transfer finishes, internal oscillator has to be enabled again.

Suggested programming steps:

Disable internal oscillator through IOEN pin

Delay (Necessary for fast MCU)

Transfer data through DIN, DCLK, LOAD

Delay (Necessary for fast MCU)

Enable internal oscillator through IOEN pin

Application Note

ML2002 데이터시트(PDF) 12 Page - Minilogic Device Corporation Limited