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ACT-RS128K32N-035P1T 데이터시트(PDF) 1 Page - Aeroflex Circuit Technology |
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ACT-RS128K32N-035P1T 데이터시트(HTML) 1 Page - Aeroflex Circuit Technology |
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1 / 8 page ![]() eroflex Circuit Technology - Advanced Multichip Modules © SCD3659 REV 3 12/17/98 128Kx8 128Kx8 128Kx8 128Kx8 CE4 OE A0 – A16 I/O0-7 I/O8-15 I/O16-23 I/O24-31 8 8 8 8 CE3 WE CE1 CE2 Block Diagram – PGA Type Package(P1) & CQFP(F2) 128Kx8 128Kx8 128Kx8 128Kx8 CE4 OE A0 – A16 I/O0-7 I/O8-15 I/O16-23 I/O24-31 8 8 8 8 CE3 WE4 WE3 WE2 WE1 CE1 CE2 Block Diagram – CQFP(F1) Pin Description I/O0-31 Data I/O A0–16 Address Inputs WE1–4 Write Enables CE1–4 Chip Enables OE Output Enable Vcc Power Supply GND Ground NC Not Connected Pin Description I/O0-31 Data I/O A0–16 Address Inputs WE Write Enable CE1–4 Chip Enables OE Output Enable Vcc Power Supply GND Ground NC Not Connected General Description The ACT–RS128K32 is a High Speed 4 megabit CMOS SRAM Multichip Module (MCM) designed for full temperature range, military, space, or high reliability mass memory and fast cache applications. The MCM can be organized as a 128K x 32 bits, 256K x 16 bits or 512k x 8 bits device and is input and output TTL compatible. Writing is executed when the write enable (WE) and chip enable (CE) inputs are low. Reading is accomplished when WE is high and CE and output enable (OE) are both low. Access time grades of 35ns and 45ns maximum are standard. The +5 Volt power supply version is standard. The products are designed for operation over the temperature range of -55°C to +125°C and screened under the full military environment. DESC Standard Military Drawing (SMD) part numbers are pending. The ACT-RS128K32 is manufactured in Aeroflex’s 80,000ft2 MIL-PRF-38534 certified facility in Plainview, N.Y. Features s 4 Low Power CMOS 128K x 8 SRAMs in one MCM s Overall configuration as 128K x 32 s Tolerant to 30KRad (Si) s Latch-up Immunity to 112MeV/(mg/cm2) s Input and Output TTL Compatible s 35 & 45ns Access Times s Full Military (-55°C to +125°C) Temperature Range s For Class K devices per MIL-PRF-38534 - Consult Factory s +5V Power Supply s Choice of 4 Hermetically sealed Co-fired Packages: q 68–Lead, Low Profile CQFP (F1), 1.56"SQ x .140"max q 68–Lead, Dual-Cavity CQFP (F2), .88"SQ x .20"max (.18"max thickness available, contact factory for details) (Drops into the 68 Lead JEDEC .99"SQ CQFJ footprint) q 66–Lead, PGA-Type (P1), 1.385"SQ x .245"max s Internal Decoupling Capacitors CIRCUIT TECHNOLOGY www.aeroflex.com/act1.htm 4 Megabit SRAM Multichip Module ACT–RS128K32 High Speed RAD Tolerant Preliminary |
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