4 Pad Plastic Package Quartz Crystal, 3.8 mm x 8 mm

IL3M Series

01/25/13_C

Specifications subject to change without notice

Page 2

Pb Free Solder Reflow Profile:

Typical Circuit:

*Units are backward compatible with 240C reflow processes

Package Information:

MSL = 2

Termination = e1 (Sn/Cu/Ag over Ni over Kovar base metal)

Tape and Reel Information:

Environmental Specifications

Thermal Shock

MIL-STD-883, Method 1011, Condition A

Moisture Resistance

MIL-STD-883, Method 1004

Mechanical Shock

MIL-STD-883, Method 2002, Condition B

Mechanical Vibration

MIL-STD-883, Method 2007, Condition A

Resistance to Soldering Heat

J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)

Hazardous Substance

Pb-Free / RoHS / Green Compliant

Solderability

JESD22-B102-D Method 2 (Preconditioning E)

Terminal Strength

MIL-STD-883, Method 2004, Test Condition D

Gross Leak

MIL-STD-883, Method 1014, Condition C

Fine Leak

MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s

Solvent Resistance

MIL-STD-202, Method 215

Marking

Line 1: 32.768

Note: Date Code on Product Label (MYY)

M=A-H(Jan –Aug), J-M (Sept-Dec)

Quantity per

Reel

3000

A

16 +/-.3

B

8 +/-.2

C

7.5 +/-.2

D

17.5 +/-1.5

E

50 / 60 / 80

F

180 / 250