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STM32F107VB 데이터시트(PDF) 35 Page - STMicroelectronics

부품명 STM32F107VB
상세설명  Connectivity line, ARM-based 32-bit MCU with 64/256 KB Flash, USB OTG, Ethernet
PDF  103 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
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STM32F107VB 데이터시트(HTML) 35 Page - STMicroelectronics

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STM32F105xx, STM32F107xx
Electrical characteristics
Doc ID 15274 Rev 6
35/104
5.3
Operating conditions
5.3.1
General operating conditions
Table 8.
Thermal characteristics
Symbol
Ratings
Value
Unit
TSTG
Storage temperature range
–65 to +150
°C
TJ
Maximum junction temperature
150
°C
Table 9.
General operating conditions
Symbol
Parameter
Conditions
Min
Max
Unit
fHCLK
Internal AHB clock frequency
0
72
MHz
fPCLK1
Internal APB1 clock frequency
0
36
fPCLK2
Internal APB2 clock frequency
0
72
VDD
Standard operating voltage
2
3.6
V
VDDA
(1)
1.
When the ADC is used, refer to Table 52: ADC characteristics.
Analog operating voltage
(ADC not used)
Must be the same potential
as VDD
(2)
2.
It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV
between VDD and VDDA can be tolerated during power-up and operation.
23.6
V
Analog operating voltage
(ADC used)
2.4
3.6
VBAT
Backup operating voltage
1.8
3.6
V
PD
Power dissipation at TA = 85 °C
for suffix 6 or TA = 105 °C for
suffix 7(3)
3.
If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax.
LFBGA100
500
mW
LQFP100
434
LQFP64
444
PD
Power dissipation at TA = 85 °C
for suffix 6 or TA = 105 °C for
suffix 7(4)
4.
If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax.
LQFP100
434
mW
LQFP64
444
TA
Ambient temperature for 6
suffix version
Maximum power dissipation
–40
85
°C
Low power dissipation(5)
5.
In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax.
–40
105
Ambient temperature for 7
suffix version
Maximum power dissipation
–40
105
°C
Low power dissipation(5)
–40
125
TJ
Junction temperature range
6 suffix version
–40
105
°C
7 suffix version
–40
125



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