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Vishay BCcomponents

Revision: 11-Feb-13

3

Document Number: 28301

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Table 2

MOUNTING

The capacitors are designed for automatic placement on to printed-circuit boards or hybrid circuits.

Optimum dimensions of soldering pads depend amongst others on soldering method, mounting accuracy, print lay-out and/or

adjacent components.

For recommended soldering pad dimensions, refer to Fig. 3 and Table 2.

Fig. 3 - Recommended pad dimensions for reflow and wave soldering

SOLDERING

Soldering conditions are defined by the curve, temperature

versus time, where the temperature is that measured on the

soldering pad during processing.

For maximum conditions of different soldering methods see

Fig. 4, 5 and 6.

Any temperature versus time curve which does not exceed

the specified maximum curves may be applied.

AS

A

GENERAL

PRINCIPLE,

TEMPERATURE

AND

DURATION SHALL BE THE MINIMUM NECESSARY

REQUIRED

TO

ENSURE

GOOD

SOLDERING

CONNECTIONS. HOWEVER, THE SPECIFIED MAXIMUM

CURVES SHOULD NEVER BE EXCEEDED.

Table 3

RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters (placement accuracy ± 0.25 mm)

NOMINAL CASE SIZE

L x W x H

FOR REFLOW SOLDERING

FOR WAVE SOLDERING

AB

C

D

E

F

G

A

B

C

DE

F

G

14.3 x 6.2 x 6.9

15.8

8.8

3.5

2.8

8.0

16.2

7.7

18.6

10.0

4.3

5.0

8.8

20.5

11.5

14.3 x 7.6 x 8.2

15.8

8.8

3.5

2.8

8.0

16.2

9.1

18.6

10.0

4.3

6.0

8.8

21.5

13.0

Solder land/

solder paste

pattern

Solder resist

pattern

Occupied

area

Tracks or

dummy tracks

E

D

C

B

A

F

E

D

G

G

C

B

A

F

Reflow soldering

Wave soldering

CURING CONDITIONS FOR SMD-GLUE

(°C)

MAX. EXPOSURE TIME

(min)

125

30

140

10

150

5

160

2

160

2