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HSP062-2 데이터시트(PDF) 7 Page - STMicroelectronics |
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HSP062-2 데이터시트(HTML) 7 Page - STMicroelectronics |
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7 / 11 page ![]() HSP062-2 Recommendation on PCB assembly Doc ID 022778 Rev 1 7/11 4 Recommendation on PCB assembly 4.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 13. Stencil opening dimensions b) General design rule Stencil thickness (T) = 75 ~ 125 µm 2. Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for leads: Opening to footprint ratio is 90%. Figure 14. Recommended stencil window position L T W Aspect Ratio W T ----- 1.5 ≥ = Aspect Area LW × 2T L W + () ---------------------------- 0.66 ≥ = 250 µm 236 µm 15 µm 15 µm 7µm 7µm Footprint Stencil window Footprint |
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