●All specifications in this catalog and production status of products are subject to change without notice. Prior to the purchase, please contact NEC TOKIN for updated product data.

●Please request for a specification sheet for detailed product data prior to the purchase.

●Before using the product in this catalog, please read "Precautions" and other safety precautions listed in the printed version catalog.

2007.08.03 P0894EMDD03VOL03E

UC2/UD2 SERIES

14

cause malfunctioning.

4. Notes on mounting relays

- When mounting a relay onto a PC board using an

automatic chip mounter, if excessive force is applied to the

cover of the relay when the relay is chucked or inserted, the

cover may be damaged or the characteristics of the relay

degraded. Keep the force applied to the relay to within 1 kg.

- Avoid bending the pins to temporarily secure the relay to

the PC board. Bending the pins may degrade sealability or

adversely affect the internal mechanism.

- It is recommended to solder the relay onto a PC board

under the following conditions:

<1> Reflow soldering

Refer to the recommended soldering temperature profile.

<2> Flow soldering

Solder temperature: 260°C max., Time: 5 seconds max.

Preheating: 110~ 120°C /110 sec. (max.)

<3> Manual soldering

Solder temperature: 350°C, Time: 2~3 seconds

- Ventilation immediately after soldering is recommended.

Avoid immersing the relay in cleaning solvent immediately

after soldering due to the danger of thermal shock being

applied to the relay.

- Use an alcohol-based or water-based cleaning solvent.

Never use thinner and benzene because they may damage

the relay housing.

- Do not use ultrasonic cleaning because the vibration

energy generated by the ultrasonic waves may cause the

contacts to remain closed.

5. Handling

- Relays are packaged in magazine cases for shipment. If a

space is created in the case after some relays have been

removed, be sure to insert a stopper to secure the remaining

relays in the case. If relays are not well secured, vibration

during transportation may cause malfunctioning of the

contacts.

- Exercise care in handling the relay so as to avoid dropping

it or allowing it to fall. Do not use a relay that has been

dropped. If a relay drops from a workbench to the floor, a

shock of 9,800 m/s2 (1,000 G) or more is applied to the relay,

possibly damaging its functions. Even if a light shock has

been applied to the relay, thoroughly evaluate its operation

before using it.

- Latching relays are factory-set to the reset state for

shipment. A latching relay may be set, however, by vibration

or shock applied while being transported. Be sure to forcibly

reset the relay before using it in the application set. Also note

that the relay may be set by unexpected vibration or shock

when it is used in a portable set.

- The sealability of a surface-mount (SMT) relay may be lost

if the relay absorbs moisture and is then heated during

soldering. When storing relays, therefore, observe the

following points:

<1> For standard packing, please use relays within 12

months after delivery. (Storage conditions: 30 °C / 60% RH)

If the relays have moisture absorption, dehumidify as follows.

Tape packing: 50±5 °C, 200~300 hours.

Simple relay: 85±5 °C, 48 hours.

<2> For MBB packing, please use relays within 2 years after

delivery.

(Storage conditions: 30 °C / 60% RH)

After open MBB packing, please use within 3 months.

(Storage conditions: 30 °C / 60% RH)