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DS21989B-page 17

MCP1256/7/8/9

10-Lead Plastic Micro Small Outline Package (UN) (MSOP)

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254 mm) per side.

.037 REF

F

Footprint

Notes:

Revised 09-16-05

* Controlling Parameter

Mold Draft Angle Top

Mold Draft Angle Bott om

Foot Angle

Lead Width

Lead Thickness





c

B



.003

.006

–

.009

Dimension Limits

Overall Height

Molded Package Thickness

Molded Package Width

Overall Length

Foot Length

Standoff

Overall Width

Number of Pins

Pitch

A

L

E1

D

A1

E

A2

.016

.024

.118 BSC

.118 BSC

.000

.030

.193 BSC

.033

MIN

p

n

Units

.020 BSC

NOM

10

INCHES

0.95 REF

–

0.23

.009

.012

0.08

0.15

–

–

0.23

0.30

MILLIMETERS

*

0.50 BSC

0.85

3.00 BSC

3.00 BSC

0.60

4.90 BSC

.043

.031

.037

.006

0.40

0.00

0.75

MIN

MAX

NOM

1.10

0.80

0.15

0.95

MAX

10

5°

15°

5°

15°

–

–

–

0°

–

8°

5°

–

5°

–

15°

15°

JEDEC Equivalent: MO-187 BA

8°

0°

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dime

nsion, usually witho ut tolerance, for information purposes only.

See ASME Y14.5M

See ASME Y14.5M

Drawing No. C04-021

E

L

D



B

p

E1

n





A2

1

2

c

A1

A

(F)

Note:

For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging