MCP6482-ESLASHMS datasheet(23/50 Pages) MICROCHIP

23 / 50 page

 2012-2013 Microchip Technology Inc.

DS20002322C-page 23

MCP6481/2/4

6.0

PACKAGING INFORMATION

6.1

Package Marking Information

5-Lead SOT-23 (MCP6481 only)

Example

3F25

Part Number

Code

MCP6481T-E/OT

3FNN

5-Lead SC-70 (MCP6481 only)

Example

DQ25

8-Lead SOIC (3.90 mm) (MCP6482 only)

Example

MCP6482

E/SN1320

256

Part Number

Code

MCP6481T-E/LTY

DQNN

8-Lead MSOP (3x3 mm) (MCP6482 only)

Example

6482E

320256

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

Legend: XX...X

Customer-specific information

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

)

can be found on the outer packaging for this package.

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