| 전자부품 데이터시트 검색엔진 |
|
MCP73123-22S/MF 데이터시트(PDF) 17 Page - Microchip Technology |
|
|
|||||||||||||||||||||||||||||
MCP73123-22S/MF 데이터시트(HTML) 17 Page - Microchip Technology |
|
17 / 28 page ![]() 2009-2013 Microchip Technology Inc. DS22191E-page 17 MCP73123/223 6.2 PCB Layout Issues For optimum voltage regulation, place the battery pack as close as possible to the device’s VBAT and VSS pins to minimize voltage drops along the high-current- carrying PCB traces. If the PCB layout is used as a heat sink, adding multiple vias in the heat sink pad can help conduct more heat to the backplane of the PCB, thus reducing the maximum junction temperature. Figure 6-3, Figure 6-4 and Figure 6-5 depict a typical layout with PCB heatsinking. FIGURE 6-3: Typical Layout (Top). FIGURE 6-4: Typical Layout (Top Metal). FIGURE 6-5: Typical Layout (Bottom). MCP73X23EV-LFP |
|
|
링크 URL |
| ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크 투 데이터시트 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |