MCP14700T-ESLASHMF datasheet(9/28 Pages) MICROCHIP

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 2009-2013 Microchip Technology Inc.

DS22201B-page 9

MCP14700

3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

3.1

Switch Node (PHASE)

The PHASE pin provides a return path for the high-side

gate driver. The source of the high-side and the drain of

the low-side power MOSFETs are connected to this

pin.

3.2

High-Side PWM Control Input

Signal (PWMHI)

The PWM input signal to control the high-side power

MOSFET is applied to the PWMHI pin. A logic high on

the PWMHI pin causes the HIGHDR pin to also

transition high.

3.3

Low-Side PWM Control Input

Signal (PWMLO)

The PWM input signal to control the low-side power

MOSFET is applied to the PWMLO pin. A logic high on

the PWMLO pin causes the LOWDR pin to also

transition high.

3.4

Ground (GND)

The GND pin provides ground for the MCP14700

circuitry. It should have a low-impedance connection to

the bias supply source return. High peak currents will

flow out the GND pin when the low-side power

MOSFET is being turned off.

3.5

Low-side Gate Drive (LOWDR)

The LOWDR pin provides the gate drive signal to

control the low-side power MOSFET. The gate of the

low-side power MOSFET is connected to this pin.

3.6

Supply Input Voltage (VCC)

The VCC pin provides bias to the MCP14700 device. A

bypass capacitor is to be placed between this pin and

the GND pin. This capacitor should be placed as close

to the MCP14700 as possible.

3.7

Floating Bootstrap Supply (BOOT)

The BOOT pin is the floating bootstrap supply pin for

the high-side gate drive. A capacitor is connected

between this pin and the PHASE pin to provide the

necessary charge to turn on the high-side power

MOSFET.

3.8

High-Side Gate Drive (HIGHDR)

The HIGHDR pin provides the gate drive signal to

control the high-side power MOSFET. The gate of the

high-side power MOSFET is connected to this pin.

3.9

Exposed Metal Pad (EP)

The exposed metal pad of the DFN package is not

internally connected to any potential. Therefore, this

pad can be connected to a ground plane or other

copper plane on a printed circuit board to aid in heat

removal from the package.

TABLE 3-1:

PIN FUNCTION TABLE

MCP14700

Symbol

Description

3x3 DFN

SOIC

PHASE

Switch Node

PWMHI

High-Side PWM Control Input Signal

PWMLO

Low-Side PWM Control Input Signal

GND

Ground

LOWDR

Low-side Gate Drive

VCC

Supply Input Voltage

BOOT

Floating Bootstrap Supply

HIGHDR

High-Side Gate Drive

—

Exposed Metal Pad

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