MCP6H74-ESLASHST datasheet(23/42 Pages) MICROCHIP

23 / 42 page

 2012 Microchip Technology Inc.

DS22325B-page 23

MCP6H71/2/4

6.0

PACKAGING INFORMATION

6.1

Package Marking Information

8-Lead SOIC (150 mil.) (MCP6H71, MCP6H72)

Example:

Legend: XX...X

Customer-specific information

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

)

can be found on the outer packaging for this package.

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

Example:

8-Lead 2x3 TDFN (MCP6H71, MCP6H72)

MCP6H71E

SN ^^1232

256

ABC

232

Part Number

Code

MCP6H71T-E/MNY

ABC

MCP6H72T-E/MNY

ABD

14-Lead SOIC (150 mil) (MCP6H74)

Example:

YYWW

NNN

XXXXXXXX

14-Lead TSSOP (MCP6H74)

Example:

MCP6H74

E/SL

1232256

6H74E/ST

1232

256

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