MCP1603 datasheet(13/34 Pages) MICROCHIP

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 2007-2012 Microchip Technology Inc.

DS22042B-page 13

MCP1603/B/L

3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

3.1

Power Supply Input Voltage Pin

(VIN)

Connect the input voltage source to VIN. The input

source must be decoupled to GND with a 4.7 µF

capacitor.

3.2

Ground Pin (GND)

Ground pin for the device. The loop area of the ground

traces should be kept as minimal as possible.

3.3

Shutdown Control Input Pin

(SHDN)

The SHDN pin is a logic-level input used to enable or

disable the device. A logic high (>45% of VIN) will

enable the regulator output. A logic low (<15% of VIN)

will ensure that the regulator is disabled.

3.4

Feedback / Output Voltage Pin

(VFB/VOUT)

For adjustable output options, connect the center of the

output voltage divider to the VFB/VOUT pin. For fixed-

output voltage options, connect the output directly to

the VFB/VOUT pin.

3.5

Switch Node, Buck Inductor

Connection Pin (LX)

Connect the LX pin directly to the buck inductor. This

pin carries large signal-level current; all connections

should be made as short as possible.

3.6

Exposed Metal Pad (EP)

For the DFN package, connect the Exposed Pad to

GND, with vias into the GND plane. This connection to

the GND plane will aid in heat removal from the

package.

TABLE 3-1:

PIN FUNCTION TABLE

MCP1603/B

TSOT-23

MCP1603L

TSOT-23

MCP1603

2x 3 DFN

Symbol

Description

VIN

Power Supply Input Voltage Pin

GND

Ground Pin

SHDN

Shutdown Control Input Pin

VFB/VOUT

Feedback / Output Voltage Pin

Switch Node, Buck Inductor Connection Pin

—

2, 5, 6

No Connect

—

Exposed

Pad

For the DFN package, the center exposed pad is a thermal

path to remove heat from the device. Electrically, this pad is

at ground potential and should be connected to GND.

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