DAC8420FSZ2 datasheet(6/24 Pages) AD

6 / 24 page

DAC8420

Rev. B | Page 6 of 24

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 3.

Parameter

Rating

VDD to GND

−0.3 V, +18.0 V

VSS to GND

+0.3 V, −18.0 V

VSS to VDD

−0.3 V, +36.0 V

VSS to VVREFLO

−0.3 V, VSS − 2.0 V

VVREFHI to VVREFLO

+2.0 V, VDD − VSS

VVREFHI to VDD

+2.0 V, +33.0 V

IVREFHI, IVREFLO

10 mA

Digital Input Voltage to GND

−0.3 V, VDD + 0.3 V

Output Short-Circuit Duration

Indefinite

Operating Temperature Range

EP, FP, ES, FS, EQ, FQ

–40°C to +85°C

Dice Junction Temperature

150°C

Storage Temperature Range

–65°C to +150°C

Power Dissipation

1000 mW

Lead Temperature

JEDEC Industry Standard

Soldering

J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

Table 4.

Package Type

θJA

θJC

Unit

16-Lead PDIP (N)

701

°C/W

16-Lead CERDIP (Q)

821

°C/W

16-Lead SOIC (RW)

862

°C/W

1 θJA is specified for worst case mounting conditions, that is, θJA is specified for

device in socket.

2 θJA is specified for device on board.

ESD CAUTION

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