MPC5607B datasheet(63/110 Pages) FREESCALE

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Electrical characteristics

MPC5607B Microcontroller Data Sheet, Rev. 6

Freescale Semiconductor

4.10.3

Start-up/Switch-off timings

4.11

Electromagnetic compatibility (EMC) characteristics

Susceptibility tests are performed on a sample basis during product characterization.

4.11.1

Designing hardened software to avoid noise problems

EMC characterization and optimization are performed at component level with a typical application environment and simplified

MCU software. It should be noted that good EMC performance is highly dependent on the user application and the software in

particular.

Therefore it is recommended that the user apply EMC software optimization and prequalification tests in relation with the EMC

level requested for the application.

•

Software recommendations

The software flowchart must include the management of runaway conditions such as:

— Corrupted program counter

Table 31. Flash power supply DC electrical characteristics

Symbol

Parameter

Conditions1

1 V

DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = –40 to 125 °C, unless otherwise specified

Value

Unit

Min

Typ

Max

ICFREAD CC Sum of the current consumption on

VDD_HV and VDD_BV on read access

Flash module read

fCPU = 64 MHz

Code Flash

—

IDFREAD

Data Flash

—

ICFMOD CC Sum of the current consumption on

VDD_HV and VDD_BV on matrix

modification (program/erase)

Program/Erase

on-going while reading

Flash registers

fCPU = 64 MHz

Code Flash

—

IDFMOD

Data Flash

—

ICFLPW CC Sum of the current consumption on

VDD_HV and VDD_BV during Flash low

power mode

—

Code Flash

—

1.1

IDFLPW

Data Flash

—

900

µA

ICFPWD CC Sum of the current consumption on

VDD_HV and VDD_BV during Flash

power down mode

—

Code Flash

—

150

µA

IDFPWD

Data Flash

—

150

Table 32. Start-up time/Switch-off time

Symbol

Parameter

Conditions1

1 V

DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C, unless otherwise specified

Value

Unit

Min

Typ

Max

tFLARSTEXIT

CC T Delay for Flash module to exit reset mode

—

125

µs

tFLALPEXIT

CC T Delay for Flash module to exit low-power mode

—

0.5

tFLAPDEXIT

CC T Delay for Flash module to exit power-down mode

—

tFLALPENTRY CC T Delay for Flash module to enter low-power mode

—

0.5

tFLAPDENTRY CC T Delay for Flash module to enter power-down mode

—

1.5

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