MPX5010 SERIES

3

Motorola Sensor Device Data

ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING

Figure 2 illustrates the Differential/Gauge Sensing Chip in

the basic chip carrier (Case 867). A fluorosilicone gel isolates

the die surface and wire bonds from the environment, while

allowing the pressure signal to be transmitted to the sensor

diaphragm.

The MPX5010 series pressure sensor operating character-

istics, and internal reliability and qualification tests are based

on use of dry air as the pressure media. Media, other than dry

air, may have adverse effects on sensor performance and

long–term reliability. Contact the factory for information

regarding media compatibility in your application.

Figure 3 shows a typical decoupling circuit for interfacing

the integrated sensor to the A/D input of a microprocessor.

Proper decoupling of the power supply is recommended.

Figure 4 shows the sensor output signal relative to pres-

sure input. Typical, minimum, and maximum output curves

are shown for operation over a temperature range of 0

° to

85

°C using the decoupling circuit below. (The output will sat-

urate outside of the specified pressure range.)

Figure 2. Cross–Sectional Diagram

(Not to Scale)

µ PROCESSOR

A/D

51 k

50 pF

MPX5010

OUTPUT

(PIN 1)

Figure 3. Typical Decoupling Filter for Sensor to

Microprocessor Interface

SILICONE

DIE COAT

WIRE BOND

LEAD FRAME

DIE

STAINLESS STEEL

METAL COVER

RTV DIE

BOND

P1

P2

EPOXY CASE

Figure 4. Output versus Pressure Differential

DIFFERENTIAL PRESSURE (kPa)

5.0

4.0

3.0

2.0

0

11

7

3

0

9

5

4.5

3.5

2.5

1.5

1

1.0

0.5

10

6

28

4

TRANSFER FUNCTION:

Vout = VS*(0.09*P+0.04) ± ERROR

VS = 5.0 Vdc

TEMP = 0 to 85

°C

TYPICAL

MAX

MIN