OMAP3530ECBBA datasheet(255/264 Pages) TI1

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PACKAGE CHARACTERISTICS

7.1 Package Thermal Resistance

7.2 Device Support

7.2.1

Device and Development-Support Tool Nomenclature

OMAP3530/25 Applications Processor

www.ti.com

SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009

Table 7-1 provides the thermal resistance characteristics for the recommended package types used on the

OMAP3530/25 Applications Processor.

Table 7-1. OMAP3530/25 Thermal Resistance Characteristics(1) (2)

Package

Power (W)(3)

RθJA(°C/W)

RθJB(°C/W)

RθJC(°C/W)

(4)

Board Type

OMAP3530/25

0.92871

24.46

10.94

(5)2S2P(6)

(CBB Pkg.)

OMAP35 30/25

0.92871

21.89

6.23

(5)

2S2P(6)

(CBC Pkg.)

OMAP35 30/25

0.92871

23.69

8.1

2.31

2S2P(6)

(CUS Pkg.)

(1)

RθJA (Theta-JA) = Thermal Resistance Junction-to-Ambient, °C/W

(2)

This table provides simulation data and may not represent actual use-case values.

RθJB (Theta-JB) = Thermal Resistance Junction-to-Board, °C/W

RθJC (Theta-JC) = Thermal Resistance Junction-to-Case, °C/W

(3)

These numbers are based on simulation results and don’t necessarily represent the wattage that the part will take in actual use.

(4)

It is recommended to dissipate the heat to the board instead of attempting to remove it from the top of the chip; therefore, top-side heat

sinks should not be used for package.

(5)

Not applicable if the POP package has a memory package on top; no heat sink can be used.

(6)

The board types are defined by JEDEC (reference JEDEC standard JESD51-9, Test Board for Area Array Surface Mount Package

Thermal Measurements).

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all

OMAP processors and support tools. Each OMAP device has one of three prefixes: X, P, or null (no

prefix). Texas Instruments recommends two of three possible prefix designators for its support tools:

TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering

prototypes (TMDX) through fully qualified production devices/tools (TMDS).

Device development evolutionary flow:

Experimental device that is not necessarily representative of the final device’s electrical

specifications and may not use production assembly flow. (TMX definition)

Prototype device that is not necessarily the final silicon die and may not necessarily meet

final electrical specifications. (TMP definition)

null

Production version of the silicon die that is fully qualified. (TMS definition)

Support tool development evolutionary flow:

TMDX

Development support product that has not yet completed Texas Instruments internal

qualification testing.

TMDS

Fully qualified development support product.

TMX and TMP devices and TMDX development-support tools are shipped against the following

disclaimer:

“Developmental product is intended for internal evaluation purposes.”

Production devices and TMDS development-support tools have been characterized fully, and the quality

and reliability of the device have been demonstrated fully. TI’s standard warranty applies.

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PACKAGE CHARACTERISTICS

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