LT1158

21

1158fb

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

S16 (WIDE) 0502

NOTE 3

.398 – .413

(10.109 – 10.490)

NOTE 4

16

15

14

13

12

11

10

9

1

N

23

4

5

6

78

N/2

.394 – .419

(10.007 – 10.643)

.037 – .045

(0.940 – 1.143)

.004 – .012

(0.102 – 0.305)

.093 – .104

(2.362 – 2.642)

.050

(1.270)

BSC

.014 – .019

(0.356 – 0.482)

TYP

0

° – 8° TYP

NOTE 3

.009 – .013

(0.229 – 0.330)

.005

(0.127)

RAD MIN

.016 – .050

(0.406 – 1.270)

.291 – .299

(7.391 – 7.595)

NOTE 4

× 45°

.010 – .029

(0.254 – 0.737)

INCHES

(MILLIMETERS)

NOTE:

1. DIMENSIONS IN

2. DRAWING NOT TO SCALE

3. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS.

THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS

4. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)

.420

MIN

.325

±.005

RECOMMENDED SOLDER PAD LAYOUT

.045

±.005

N

12

3

N/2

.050 BSC

.030

±.005

TYP

N16 1002

.255

± .015*

(6.477

± 0.381)

.770*

(19.558)

MAX

16

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

.020

(0.508)

MIN

.120

(3.048)

MIN

.130

± .005

(3.302

± 0.127)

.065

(1.651)

TYP

.045 – .065

(1.143 – 1.651)

.018

± .003

(0.457

± 0.076)

.008 – .015

(0.203 – 0.381)

.300 – .325

(7.620 – 8.255)

.325

+.035

–.015

+0.889

–0.381

8.255

()

NOTE:

1. DIMENSIONS ARE

INCHES

MILLIMETERS

*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)

.100

(2.54)

BSC

PACKAGE DESCRIPTION

SW Package

16-Lead Plastic Small Outline (Wide .300 Inch)

(Reference LTC DWG # 05-08-1620)

N Package

16-Lead PDIP (Narrow .300 Inch)

(Reference LTC DWG # 05-08-1510)