ADP170/ADP171

Rev. B | Page 16 of 20

J1

ANALOG DEVICES

ADP171-x.x-EVALZ

VIN

VOUT

GND

EN

GND

C1

C2

GND

GND

U1

R2

R1

PRINTED CIRCUIT BOARD LAYOUT

CONSIDERATIONS

Heat dissipation from the package can be improved by

increasing the amount of copper attached to the pins of the

ADP170/ADP171. However, as can be seen from Table 6, a

point of diminishing returns is eventually reached, beyond

which an increase in the copper size does not yield significant

heat dissipation benefits.

Place the input capacitor as close as possible to the VIN and

GND pins. Place the output capacitor as close as possible to the

VOUT and GND pins. Use of 0402 or 0603 size capacitors and

resistors achieves the smallest possible footprint solution on

boards where area is limited.

J1

ANALOG DEVICES

ADP170-x.x-EVALZ

VIN

VO UT

GND

EN

GND

C1

C2

GND

GND

U1

Figure 41. Example ADP171 PCB Layout

Figure 40. Example ADP170 PCB Layout