REV. E

AMP02

–3–

AMP02E

AMP02F

Parameter

Symbol

Conditions

Min

Typ

Max

Min

Typ

Max

Unit

POWER SUPPLY

Supply Voltage Range

±4.5

±18

±4.5

±18

V

Supply Current

°C5

6

5

6

mA

–40

6

5

6

mA

NOTES

Specifications subject to change without notice.

ABSOLUTE MAXIMUM RATINGS

1, 2

Supply Voltage

±18 V

Common-Mode Input Voltage [(V–) – 60 V] to [(V+) + 60 V]

Differential Input Voltage

[(V–) – 60 V] to [(V+) + 60 V]

Output Short-Circuit Duration

Continuous

Operating Temperature Range

–40

°C to +85°C

Storage Temperature Range

–65

°C to +150°C

Function Temperature Range

–65

°C to +150°C

Lead Temperature (Soldering, 10 sec)

300

°C

Package Type

JA

3

JC

Unit

8-Lead Plastic DIP (P)

96

37

°C/W

16-Lead SOIC (S)

92

27

°C/W

–IN

+IN

25k

25k

25k

25k

V+

SENSE

OUT

REFERENCE

V–

Figure 2. Simplified Schematic

ORDERING GUIDE

Package

Model

Range

Description

AMP02EP

100

µV4 mV

–40

°C to +85°C

8-Lead Plastic DIP

AMP02FP

200

µV8 mV

–40

°C to +85°C

8-Lead Plastic DIP

AMP02AZ/883C

200

µV

10 mV

–55

°C to +125°C 8-Lead CERDIP

AMP02FS

200

µV8 mV

–40

°C to +85°C

16-Lead SOIC

AMP02GBC

Die

AMP02FS-REEL

200

µV8 mV

–40

°C to +85°C

16-Lead SOIC

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational sections

of this specifications is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

otherwise noted.

3

θ

θ

device in socket for P-DIP package;

θ

printed circuit board for SOIC package.