AD9912ABCPZ datasheet(24/40 Pages) AD

24 / 40 page

AD9912

Rev. F | Page 24 of 40

THERMAL PERFORMANCE

Table 7. Thermal Parameters

Symbol

Thermal Characteristic Using a JEDEC51-7 Plus JEDEC51-5 2S2P Test Board

Value

Unit

θJA

Junction-to-ambient thermal resistance, 0.0 m/sec air flow per JEDEC JESD51-2 (still air)

25.2

°C/W

θJMA

Junction-to-ambient thermal resistance, 1.0 m/sec air flow per JEDEC JESD51-6 (moving air)

22.0

°C/W

θJMA

Junction-to-ambient thermal resistance, 2.0 m/sec air flow per JEDEC JESD51-6 (moving air)

19.8

°C/W

θJB

Junction-to-board thermal resistance, 1.0 m/sec air flow per JEDEC JESD51-8 (moving air)

13.9

°C/W

θJC

Junction-to-case thermal resistance (die-to-heat sink) per MIL-Std 883, Method 1012.1

1.7

°C/W

ΨJT

Junction-to-top-of-package characterization parameter, 0 m/sec air flow per JEDEC JESD51-2 (still air)

0.1

°C/W

The AD9912 is specified for a case temperature (TCASE). To

ensure that TCASE is not exceeded, an airflow source can be used.

Use the following equation to determine the junction tempera-

ture on the application PCB:

= TCASE + (ΨJT × PD)

where:

is the junction temperature (°C).

TCASE

is the case temperature (°C) measured by customer at top

center of package.

ΨJT

is the value from Table 7.

is the power dissipation (see the Total Power Dissipation

section in the Specifications section).

Values of θJA are provided for package comparison and PCB

design considerations. θJA can be used for a first-order

approximation of TJ by the equation

= TA + (θJA × PD)

where TA is the ambient temperature (°C).

Values of θJC are provided for package comparison and PCB

design considerations when an external heat sink is required.

Values of θJB are provided for package comparison and PCB

design considerations.

The values in Table 7 apply to both 64-lead package options.

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