LP2992

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SNVS171G – NOVEMBER 2001 – REVISED MARCH 2013

REVERSE INPUT-OUTPUT VOLTAGE

The PNP power transistor used as the pass element in the LP2992 has an inherent diode connected between

the regulator output and input. During normal operation (where the input voltage is higher than the output) this

diode is reverse-biased.

However, if the output is pulled above the input, this diode will turn ON and current will flow into the regulator

ground pin), which can damage the part.

In any application where the output may be pulled above the input, an external Schottky diode must be

0.3V (see Absolute Maximum Ratings).

WSON MOUNTING

The WSON package requires specific mounting techniques which are detailed in Application Note # 1187

(literature number SNOA401). Referring to the section PCB Design Recommendations, it should be noted that

the pad style which should be used with the WSON package is the NSMD (non-solder mask defined) type.

The thermal dissipation of the WSON package is directly related to the printed circuit board construction and the

amount of additional copper area.

For the LP2992 in the NGD0006A 6-Lead WSON package, the junction-to-case thermal rating,

where the case is actually the bottom of the package at the center of the DAP. The junction-to-ambient thermal

performance for the LP2992 in the NGD0006A 6-Lead WSON package, using the JEDEC standards is

summarized in the following table:

Board

Thermal

Type

Vias

JEDEC

None

19°C/W

282°C/W

2–Layer

1

19°C/W

94°C/W

2

19°C/W

78°C/W

JEDEC

4–Layer

4

19°C/W

66°C/W

6

19°C/W

62°C/W

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