Product family data sheet

Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice.

Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.

Product descriPtion

Built on Cree’s revolutionary SC³

Technology™ platform, the XLamp

MK-R LeD brings new levels of price

and

performance

to

directional

LeD

arrays,

enabling

lighting

manufacturers to create the next

generation of high-lumen indoor

and outdoor LeD lighting systems.

In single-LeD systems, the XLamp

MK-R, with easyWhite™ color binning,

provides the LeD industry’s tightest

unit-to-unit color consistency. For

systems using multiple LeDs, the

MK-R enables manufacturers to use

fewer LeDs while maintaining light

output and color consistency, which

translates to lower system cost.

The XLamp MK-R is optimized for

directional lighting applications and

is a welcome addition to applications

requiring high lumen output, a

compact optical source and a broad

palette of color temperature and CRI

values.

features

• Available in ANSI white bins

as well as 4-step and 2-step

easyWhite bins at 2700 K,

3000 K, 3500 K, 4000 K, 4500 K

and 5000 K CCT

• Maximum drive current:

1250 mA

• Low thermal resistance:

1.7 °C/W

• Maximum junction temperature:

150 °C

• Binned at 85 °C

• viewing angle: 120°

• Available in cool white, 70-, 80-

and 90-CRI minimums

• Unlimitedfloorlifeat

≤30ºC/85%RH

• Reflowsolderable-JEDEC

J-STD-020C

• electrically neutral thermal path

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

www.cree.com/xlamp

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

table of contents

Characteristics ............................ 2

Flux Characteristics, Standard

Order Codes and Bins .................. 2

Standard Order Codes and Bins ..... 3

Relative Spectral Power

Distribution................................. 4

RelativeFluxvs.Junction

Temperature ............................... 4

electrical Characteristics............... 5

Thermal Design........................... 5

Relative Flux vs. Current .............. 6

Relative Chromaticity vs. Current... 6

Relative Chromaticity vs.

Temperature ............................... 7

Typical Spatial Distribution............ 7

Performance Groups - Brightness... 8

Performance Groups -

Chromaticity ............................... 9

Cree easyWhite Bins Plotted on the

1931 CIe Color Space .................12

Cree ANSI White Bins Plotted on

the 1931 CIe Color Space ............13

Bin and Order Code Formats ........14

ReflowSolderingCharacteristics ...15

Notes........................................16

Mechanical Dimensions................17

Tape and Reel ............................18

Packaging..................................19