• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

C31E.pdf

Mar.28,2011

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4. Cleaning

5. Mounting of BLM15_AN1 Series

BLM15_AN1 is series for wire bonding mounting.

(1) Die Bonding Mounting

(a) Dimension of Standard Metal Mask

(b) Die Bonding Agent

o Use adhesive for die bonding for which the curing

temperature is 200

°C or less.

(c) Notice

o Use a flat surface of substrate for bonding mounting.

Slant mounting of product may affect the wire bonding.

o Adhesive for die bonding may affect the mounting

reliability in wire bonding.

Make sure of the mounting reliability with the adhesive to

be used in advance.

0.7

Chip Ferrite Bead

Metal thickness: 50

µm

(in mm)

Following conditions should be observed when cleaning

chip ferrite beads.

(1) Cleaning Temperature: 60

°C max. (40°C max. for

alcohol type cleaner)

(2) Ultrasonic

Output: 20W/liter max.

Duration: 5 minutes max.

Frequency: 28 to 40kHz

(3) Cleaning Agent

The following list of cleaning agents have been tested on

the individual components. Evaluation of final assembly

should be completed prior to production.

(a) Alcohol cleaning agent

Isopropyl alcohol (IPA)

(b) Aqueous cleaning agent

Pine Alpha ST-100S

(4) Ensure that flux residue is completely removed.

Component should be thoroughly dried after aqueous

agent has been removed with deionized water.

(5) BLM_G type is processed with resin. On rinsing the

product, using water for ultrasonic cleaning may affect

the resin quality used for the product by water element. In

case of set cleaning conditions, please make sure the

reliability according to the cleaning conditions.

BLp Chip Ferrite Bead

Soldering and Mounting

(3) Reworking with Solder Iron

The following conditions must be strictly followed when

using a soldering iron.(Except BLM02 Series)

Pre-heating: 150

°C 60s min.

Soldering iron power output / Tip diameter:

80W max. / ø3mm max.

Temperature of soldering iron tip / Soldering time / Times:

350

°C max. / 3-4s / 2 times

Do not allow the tip of the soldering iron to directly

contact the chip.

For additional methods of reworking with a soldering iron,

please contact Murata engineering.