BAS16LD

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© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 1 — 12 October 2010

3 of 11

NXP Semiconductors

BAS16LD

Single high-speed switching diode

5.

Limiting values

[1]

Device mounted on an FR4 PCB with 60

μm copper strip line.

[2]

[3]

Reflow soldering is the only recommended soldering method.

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB with 60

μm copper strip line.

[2]

Reflow soldering is the only recommended soldering method.

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

repetitive peak reverse

voltage

-100

V

reverse voltage

-

100

V

forward current

[1]

215

mA

repetitive peak forward

current

δ≤ 0.25

-500

mA

non-repetitive peak forward

current

square wave

[2]

4

A

-

1

A

-

0.5

A

total power dissipation

[1][3] -250

mW

junction temperature

-

150

°C

ambient temperature

−55

+150

°C

storage temperature

−65

+150

°C

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from

junction to ambient

in free air

[1][2] -

-

500

K/W