• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

C31E.pdf

Mar.28,2011

177

2. Solder Paste Printing and Adhesive Application

(in mm)

the following cream solder printing conditions.

If too much solder is applied, the chip will be prone to

damage by mechanical and thermal stress from the PCB

and may crack.

Standard land dimensions should be used for resist and

copper foil patterns.

apply the adhesive in accordance with the following

conditions.

If too much adhesive is applied, then it may overflow into

the land or termination areas and yield poor solderability.

In contrast, if insufficient adhesive is applied, or if the

adhesive is not sufficiently hardened, then the chip may

become detached during flow soldering process.

DLP

DLW

DLM

oGuideline of solder paste thickness:

100-150

µm: DLW21S/21H/31S,

DLP0NS/11S/11T/1ND/2AD/DLM11G

150-200

µm: DLP31D/31S, DLM2HG,

DLW5AH/5BS/5BT

*Solderability is subject to reflow conditions and

thermal conductivity. Please make sure that your

product has been evaluated in view of your

specifications with our product being mounted to your

product.

DLP31S/DLM2HG/DLP31D

Apply 0.3mg of bonding agent at each chip.

Series

Solder Paste Printing

Adhesive Application

DLP31S

DLP31D

Coating Position of

Bonding Agent

Coating Position of

Bonding Agent

DLM2HG

Coating Position of

Bonding Agent

ab

a

DLW21S/21H/31S

DLP0NS/11S/11T/31S/DLM11G

a

b

DLW5AH/5BS/5BT

5.5

2.9

0.9

DLP2AD/31D

d

c

DLM2HG

1.0

4.0

DLP0NS

DLP11S

DLP11T

DLP31S

DLM11G

0.3

0.7

0.5

1.0

0.5

0.3

0.3

0.3

0.7

0.4

Series

a

0.5

0.55

0.55

2.1

0.7

d

0.3

0.55

0.55

0.6

0.5

bc

DLW21S/H

DLW31S

0.8

1.6

0.5

0.4

Series

a

1.2

1.6

d

2.6

3.7

bc

DLP1ND

DLP2AD

DLP31D

0.3

0.55

1.0

0.2

0.25

0.4

Series

a

0.4

0.5

0.8

d

0.3

0.4

0.8

bc

DLp Chip Common Mode Choke Coil

Soldering and Mounting