• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

C31E.pdf

Mar.28,2011

91

BLM02

BLM03

BLM15

BLM18

BLM21

• Except BLM03PG/15AX·PD·PG/18PG·KG·SG/21PG.

And BLM02/03/15/18G is specially adapted for reflow

soldering.

Reflow

Reflow

Reflow

Flow

(except 18G)

Reflow

Flow/

Reflow

Type

0.16-0.2

0.2-0.3

0.4

0.7

1.2

a

0.4-0.56

0.6-0.9

1.2-1.4

2.2-2.6

1.8-2.0

3.0-4.0

b

Soldering

0.2-0.23

0.3

0.5

0.7

1.0

c

oReflow and Flow

BLMppAX/P/K/S

BLM Series

BLM02

BLM03

BLM15

BLM18

BLM21

BLM31

BLM41

a

b

a

b

(Except BLM

15_AN1 series)

Land Pattern

Land Pattern

+ Solder Resist

Solder Resist

(in mm)

1. Standard Land Pattern Dimensions

Soldering and Mounting

Chip Ferrite Bead

BLA2A

BLA31

oReflow Soldering

oReflow and Flow

BLA2A

BLA31

• If there are high amounts of self-heating on pattern, the

contact points of PCB and part may become damaged.

0.4

0.8 Pitch

2.8

0.25

0.5 Pitch

1.75

BLM03AX

BLM03PG

BLM15AX

BLM15Pp

BLM18PG

BLM18KG

BLM18SG

BLM21PG

BLM31PG

BLM41PG

1max.

1.5max.

2.2max.

0.5-1.5

1.7-2.5

3-4

6

1.5

2

3

6

1.5/2

3

6

1.5/2

3

6

0.3

0.5

0.7

1.0

1.2

0.2-0.3

0.4

0.7

1.2

2.0

3.0

3.0-4.0

4.2-5.2

5.5-6.5

0.3

0.5

1.2

0.7

1.2

2.4

6.4

1.0

1.2

2.4

6.4

1.2

2.4

6.4

1.2

2.4

6.4

0.3

0.5

0.7

0.7

0.7

1.2

3.3

1.0

1.0

1.2

3.3

1.2

1.2

3.3

1.2

1.2

3.3

0.3

0.5

0.5

0.7

0.7

0.7

1.65

1.0

1.0

1.0

1.65

1.2

1.2

1.65

1.2

1.2

1.65

18

0.6-0.9

1.2-1.4

Type

Land Pad Thickness

and Dimension d

Rated

Current

(A)

ab

c

Soldering

• Do not apply narrower pattern than listed above to

BLMppAX/P/K/S.

Narrow pattern can cause excessive heat or open circuit.

Reflow

Reflow

Flow

2.2-2.6

Reflow

1.8-2.0

Flow/

Reflow