ADP122ACPZ-2.6-R7 datasheet(15/24 Pages) AD

15 / 24 page

Data Sheet

ADP122/ADP123

Rev. E | Page 15 of 24

JUNCTION TEMPERATURE CALCULATIONS FOR TSOT PACKAGE

140

120

100

0.5

1.0

1.5

2.0

2.5

3.0

VOUT – VIN (V)

ILOAD = 1mA

ILOAD = 10mA

ILOAD = 25mA

ILOAD = 100mA

ILOAD = 150mA

ILOAD = 300mA

TJ MAX

Figure 38. Junction Temperature vs. Power Dissipation,

500 mm2 of PCB Copper, TA = 25°C

140

120

100

VOUT – VIN (V)

ILOAD = 1mA

ILOAD = 10mA

ILOAD = 25mA

ILOAD = 100mA

ILOAD = 150mA

ILOAD = 300mA

TJ MAX

0.5

1.0

1.5

2.0

2.5

3.0

Figure 39. Junction Temperature vs. Power Dissipation,

100 mm2 of PCB Copper, TA = 25°C

140

120

100

VOUT – VIN (V)

ILOAD = 1mA

ILOAD = 10mA

ILOAD = 25mA

ILOAD = 100mA

ILOAD = 150mA

ILOAD = 300mA

TJ MAX

0.5

1.0

1.5

2.0

2.5

3.0

Figure 40. Junction Temperature vs. Power Dissipation,

0 mm2 of PCB Copper, TA = 25°C

140

120

100

VOUT – VIN (V)

ILOAD = 1mA

ILOAD = 10mA

ILOAD = 25mA

ILOAD = 100mA

ILOAD = 150mA

ILOAD = 300mA

TJ MAX

0.5

1.0

1.5

2.0

2.5

3.0

Figure 41. Junction Temperature vs. Power Dissipation,

500 mm2 of PCB Copper, TA = 50°C

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