ADuCM361BCPZ128-R7 datasheet(17/24 Pages) AD

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Data Sheet

ADuCM360/ADuCM361

Rev. B | Page 17 of 24

ABSOLUTE MAXIMUM RATINGS

Table 14.

Parameter

Rating

AVDD to AGND

−0.3 V to +3.96 V

IOVDD to DGND

−0.3 V to +3.96 V

Digital Input Voltage to DGND

−0.3 V to +3.96 V

Digital Output Voltage to DGND

−0.3 V to +3.96 V

Analog Inputs to AGND

−0.3 V to +3.96 V

Operating Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature

150°C

ESD Rating, All Pins

Human Body Model (HBM)

±2.5 kV

Field-Induced Charged Device

Model (FICDM)

±1 kV

Peak Solder Reflow Temperature

SnPb Assemblies (10 sec to 30 sec)

240°C

Pb-Free Assemblies (20 sec to 40 sec)

260°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 15. Thermal Resistance

Package Type

θJA

Unit

48-Lead LFCSP_WQ

°C/W

ESD CAUTION

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