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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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SL3ICS1002F7AF 데이터시트(PDF) 14 Page - NXP Semiconductors |
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SL3ICS1002F7AF 데이터시트(HTML) 14 Page - NXP Semiconductors |
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14 / 51 page  139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 9 October 2012 139037 14 of 51 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 11. Packing information 11.1 Wafer See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BL-ID document number: 1093**”. 11.2 TSSOP See http://www.standardics.nxp.com/packaging/packing/pdf/sot505-2.t4.pdf. 11.3 SOT1122 Part orientation T1. For details please refer to http://www.standardics.nxp.com/packaging/packing/pdf/sot886.t1.t4.pdf. |
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