ADG508A/ADG509A

Rev. D | Page 16 of 16

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADG508AKN

−40°C to +85°C

16-Lead Plastic Dual In-Line Package [PDIP]

N-16

ADG508AKNZ1

−40°C to +85°C

16-Lead Plastic Dual In-Line Package [PDIP]

N-16

ADG508AKR

−40°C to +85°C

16-Lead Standard Small Outline Package [SOIC_N]

R-16

ADG508AKR-REEL

−40°C to +85°C

16-Lead Standard Small Outline Package [SOIC_N]

R-16

ADG508AKR-REEL7

−40°C to +85°C

16-Lead Standard Small Outline Package [SOIC_N]

R-16

ADG508AKRZ1

−40°C to +85°C

16-Lead Standard Small Outline Package [SOIC_N]

R-16

ADG508AKRZ-REEL1

−40°C to +85°C

16-Lead Standard Small Outline Package [SOIC_N]

R-16

ADG508AKRZ-REEL71

−40°C to +85°C

16-Lead Standard Small Outline Package [SOIC_N]

R-16

ADG508AKP

−40°C to +85°C

20-Lead Plastic Leaded Chip Carrier [PLCC]

P-20

ADG508AKP-REEL

−40°C to +85°C

20-Lead Plastic Leaded Chip Carrier [PLCC]

P-20

ADG508AKPZ1

−40°C to +85°C

20-Lead Plastic Leaded Chip Carrier [PLCC]

P-20

ADG508AKPZ-REEL1

−40°C to +85°C

20-Lead Plastic Leaded Chip Carrier [PLCC]

P-20

ADG508ABQ

−40°C to +85°C

16-Lead Ceramic Dual In-Line Package [CERDIP]

Q-16

ADG508ATQ

−55°C to +125°C

16-Lead Ceramic Dual In-Line Package [CERDIP]

Q-16

ADG508ATE

−55°C to +125°C

20-Terminal Ceramic Leadless Chip Carrier [LCC]

E-20-1

ADG508ABCHIPS

DIE

ADG508ATCHIPS

DIE

ADG509AKN

−40°C to +85°C

16-Lead Plastic Dual In-Line Package [PDIP]

N-16

ADG509AKNZ1

−40°C to +85°C

16-Lead Plastic Dual In-Line Package [PDIP]

N-16

ADG509AKR

−40°C to +85°C

16-Lead Standard Small Outline Package [SOIC_N]

R-16

ADG509AKR-REEL

−40°C to +85°C

16-Lead Standard Small Outline Package [SOIC_N]

R-16

ADG509AKR-REEL7

−40°C to +85°C

16-Lead Standard Small Outline Package [SOIC_N]

R-16

ADG509AKRZ-REEL1

−40°C to +85°C

16-Lead Standard Small Outline Package [SOIC_N]

R-16

ADG509AKRZ-REEL71

−40°C to +85°C

16-Lead Standard Small Outline Package [SOIC_N]

R-16

ADG509AKP

−40°C to +85°C

20-Lead Plastic Leaded Chip Carrier [PLCC]

P-20

ADG509AKP-REEL

−40°C to +85°C

20-Lead Plastic Leaded Chip Carrier [PLCC]

P-20

ADG509AKPZ1

−40°C to +85°C

20-Lead Plastic Leaded Chip Carrier [PLCC]

P-20

ADG509AKPZ-REEL1

−40°C to +85°C

20-Lead Plastic Leaded Chip Carrier [PLCC]

P-20

ADG509ABQ

−40°C to +85°C

16-Lead Ceramic Dual In-Line Package [CERDIP]

Q-16

ADG509ATQ

−55°C to +125°C

16-Lead Ceramic Dual In-Line Package [CERDIP]

Q-16

ADG509ATQ/883B

−55°C to +125°C

16-Lead Ceramic Dual In-Line Package [CERDIP]

Q-16

ADG509ABCHIPS

DIE

ADG509ATCHIPS

DIE

©2009 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

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