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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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RS432CMP 데이터시트(PDF) 9 Page - Orister Corporation |
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RS432CMP 데이터시트(HTML) 9 Page - Orister Corporation |
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9 / 10 page  Page No. : 9/10 DS‐RS432‐07 September, 2009 www.Orister.com Soldering Methods for Orister’s Products 1. Storage environment: Temperature=10 oC~35oC Humidity=65%±15% 2. Reflow soldering of surface‐mount devices Profile Feature Sn‐Pb Eutectic Assembly Pb‐Free Assembly Average ramp‐up rate (TL to TP) <3 oC/sec <3 oC/sec Preheat ‐ Temperature Min (Tsmin) ‐ Temperature Max (Tsmax) ‐ Time (min to max) (ts) 100 oC 150 oC 60~120 sec 150 oC 200 oC 60~180 sec Tsmax to TL ‐ Ramp‐up Rate <3 oC/sec <3 oC/sec Time maintained above: ‐ Temperature (TL) ‐ Time (tL) 183 oC 60~150 sec 217 oC 60~150 sec Peak Temperature (TP) 240 oC +0/‐5oC 260 oC +0/‐5oC Time within 5 oC of actual Peak Temperature (tP) 10~30 sec 20~40 sec Ramp‐down Rate <6 oC/sec <6 oC/sec Time 25 oC to Peak Temperature <6 minutes <8 minutes 3. Flow (wave) soldering (solder dipping) Products Peak temperature Dipping time Pb devices. 245 oC ±5oC 5sec ±1sec Pb‐Free devices. 260 oC +0/‐5oC 5sec ±1sec Figure 1: Temperature profile tP tL Ramp-down Ramp-up Tsmax Tsmin Critical Zone TL to TP tS Preheat TL TP 25 t 25oC to Peak Time |
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