| 전자부품 데이터시트 검색엔진 |
|
B330 데이터시트(PDF) 8 Page - Orister Corporation |
|
|
|||||||||||||||||||||||||||||
B330 데이터시트(HTML) 8 Page - Orister Corporation |
|
8 / 11 page ![]() Page No. : 8/11 MSOP‐10(EP) Dimension NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash, protrusion. D. This package is designed to be soldered to a thermal pad on the board. E. Falls within JEDEC MO‐187 variation BA‐T. DS‐RS6515‐08 JULY, 2010 www.Orister.com |
|
|
링크 URL |
| ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크 투 데이터시트 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |