DHG 30 IM 600 PC

advanced

I

RMS

A

per pin

35

K/W

0.25

T

stg

°C

150

storage temperature

-55

Weight

g

2

Symbol

Definition

Ratings

typ.

max.

min.

Conditions

RMS current

thermal resistance case to heatsink

Unit

I

is typically limited by: 1. pin-to-chip resistance; or by 2. current capability of the chip.

In case of 1, a common cathode/anode configuration and a non-isolated backside, the whole current capability can be used by connecting

the backside.

F

C

N

60

mounting force with clip

20

Ordering

Delivering Mode

Base Qty Code Key

Standard

Part Name

DHG 30 IM 600 PC

503501

Tape & Reel

800

Product Marking

Date Code

Part No.

Logo

Order Code

XXXXXXXXX

abcd

D

H

G

30

IM

600

PC

Part number

Diode

Sonic Fast Recovery Diode

extreme fast

Single Diode

TO-263AB (D2Pak) (2)

=

=

=

DHG30I600PA

DHG30I600HA

TO-220

TO-247

Similar Part

Package

1)

1)

Marking on Product

DHG30IM600PC

600

600

Voltage Class

Current Rating [A]

Reverse Voltage [V]

=

=

=

=

RMS

IXYS reserves the right to change limits, conditions and dimensions.

©

20081031

Data according to IEC 60747and per diode unless otherwise specified

2008 IXYS all rights reserved