ADP3338

Rev. B | Page 11 of 16

Use the following general guidelines when designing printed

circuit boards:

•

Keep the output capacitor as close as possible to the output

and ground pins.

•

Keep the input capacitor as close as possible to the input

and ground pins.

•

Specify thick copper and use wide traces for optimum heat

transfer. PC board traces with larger cross sectional areas

remove more heat from the ADP3338.

•

Decrease thermal resistance by adding a copper pad under

the ADP3338, as shown in Figure 22 (b).

•

Use the adjacent area to the ADP3338 to add more copper

around it. Connecting the copper area to the output of the

ADP3338, as shown in Figure 22 (c), is best, but thermal

performance will be improved even if it is connected to

other signals.

•

Use additional copper layers or planes to reduce the

thermal resistance. Again, connecting the other layers to

the output of the ADP3338 is best, but is not necessary.

When connecting the output pad to other layers, use

multiple vias.